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    • BOE MLED COB

      Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

      • BOE MLED COB

      • BOE MLED COB

      • BOE MLED COB

    • Product Highlights

    • Cases

    • Product Parameters

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    Product Highlights

    • RGB full flip

      Reduce cost and improve quality

    • Thin Package

      Thinner<250um

    • Black film package

      Continue to improve picture quality

    • Common cathode drive

      Better experience closer to the screen

    • High protection and high reliability

      Reduce transport and maintenance risks

    • Power/Dual-Link solution

      Major projects are guaranteed

    • Overseas qualification

      Products are available for sale overseas

    • Curved splicing

      Enable multiple scenarios

    Product Parameters

    BYH-COB
    Specifications BYH009 Ultra BYH009V1 BYH012V1 BYH015V1
    Pitch 0.9375 0.9375 1.25 1.5
    Module Size（mm） 150*337.5 150*168.75
    Cabinet Dimension（mm） 600*337.5 600*337.5
    Maintenance Mode Front
    Cabinet flatness（mm） ≤0.1
    White balance brightness（cd/m2） Typ 1500 Typ 600, 0 - 800 Adjustable
    Refresh Rate（Hz） 7680 3840
    Installation mode Stacking & Wall mounting

    * Please click on the bottom of the project for more product details.

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